Snapdragon 8 Gen 3 Mobile Platform Firmware Security Vulnerabilities

CVE-2023-33049

Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.

CVE-2023-33057

Transient DOS in Multi-Mode Call Processor while processing UE policy container.

CVE-2023-33058

Information disclosure in Modem while processing SIB5.

CVE-2023-33060

Transient DOS in Core when DDR memory check is called while DDR is not initialized.

CVE-2023-33072

Memory corruption in Core while processing control functions.

CVE-2023-33076

Memory corruption in Core when updating rollback version for TA and OTA feature is enabled.

CVE-2023-43522

Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL.

CVE-2023-43523

Transient DOS while processing 11AZ RTT management action frame received through OTA.

CVE-2023-43533

Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame.

CVE-2023-43536

Transient DOS while parse fils IE with length equal to 1.

CVE-2024-21461

Memory corruption while performing finish HMAC operation when context is freed by keymaster.

CVE-2024-21462

Transient DOS while loading the TA ELF file.

CVE-2024-21465

Memory corruption while processing key blob passed by the user.

CVE-2024-21469

Memory corruption when an invoke call and a TEE call are bound for the same trusted application.

CVE-2024-23368

Memory corruption when allocating and accessing an entry in an SMEM partition.

CVE-2024-23372

Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.

CVE-2024-23373

Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.

CVE-2024-23380

Memory corruption while handling user packets during VBO bind operation.